Explore topic-wise fullforms in Electronics

INFO: Full form for ULN is Ultra-low Noise in Electronics category
ULN also has other full forms in other categories mentioned below.

INFO: Full form for UTQ is Uniform Threshold Quantizer in Electronics category
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INFO: Full form for WCTS is World Capacitor Trade Statistics in Electronics category
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INFO: Full form for PDSA is Peroxydisulfuric Acid in Electronics category
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INFO: Full form for OVP is Optical Video Probe in Electronics category
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INFO: Full form for OVP is Over Voltage Protection in Electronics category
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Mixtures of dispersed combustible materials (such as gaseous or vaporised fuels, and some dusts) and oxygen in the air will burn only if the fuel concentration lies within well-defined lower and upper bounds determined experimentally, referred to as flammability limits or explosive limits. Combustion can range in violence from deflagration through detonation.

Limits vary with temperature and pressure, but are normally expressed in terms of volume percentage at 25 °C and atmospheric pressure. These limits are relevant both to producing and optimising explosion or combustion, as in an engine, or to preventing it, as in uncontrolled explosions of build-ups of combustible gas or dust. Attaining the best combustible or explosive mixture of a fuel and air (the stoichiometric proportion) is important in internal combustion engines such as gasoline or diesel engines.

The standard reference work is still that elaborated by Michael George Zabetakis, a fire safety engineering specialist, using an apparatus developed by the United States Bureau of Mines.

The highest concentration of a gas or vapor (percentage by volume in air) above which a flame will not spread in the presence of an ignition source (arc, flame, or heat). Concentrations higher than UEL are “too rich” to burn.

INFO: Full form for PEARL is Pulse Enhancement Artifact Rejection Logic in Electronics category
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INFO: Full form for SFB is Symmetry Breaking Force in Electronics category
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INFO: Full form for SFB is Sequential Frequency Band in Electronics category
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INFO: Full form for VVL is Video Vest, Light in Electronics category
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INFO: Full form for OEE is Optical Entrance Enclosure in Electronics category
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Overall equipment effectiveness (OEE) is a measure of how well a manufacturing operation is utilized (facilities, time and material) compared to its full potential, during the periods when it is scheduled to run. It identifies the percentage of manufacturing time that is truly productive. An OEE of 100% means that only good parts are produced (100% quality), at the maximum speed (100% performance), and without interruption (100% availability).

Measuring OEE is a manufacturing best practice. By measuring OEE and the underlying losses, important insights can be gained on how to systematically improve the manufacturing process. OEE is an effective metric for identifying losses, bench-marking progress, and improving the productivity of manufacturing equipment (i.e., eliminating waste)

Total effective equipment performance (TEEP) is a closely related measure which quantifies OEE against calendar hours rather than only against scheduled operating hours. A TEEP of 100% means that the operations have run with an OEE of 100% 24 hours a day and 365 days a year (100% loading).

The term OEE was coined by Seiichi Nakajima. It is based on the Harrington Emerson way of thinking regarding labor efficiency. The generic form of OEE allows comparison between manufacturing units in differing industries. It is not however an absolute measure and is best used to identify scope for process performance improvement, and how to get the improvement.OEE measurement is also commonly used as a key performance indicator (KPI) in conjunction with lean manufacturing efforts to provide an indicator of success. OEE can be illustrated by a brief discussion of the six metrics that comprise the system (the "Six Big Losses").

INFO: Full form for OEFS is Optical Electric Field Sensor in Electronics category
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INFO: Full form for MLCC is Multi Layer Ceramic Condesor in Electronics category
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INFO: Full form for MLCC is Multi-layer Ceramic Capacitor in Electronics category
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INFO: Full form for KEMAR is Knowles Electronics Manikin for Acoustic Research in Electronics category
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INFO: Full form for KEMAR is Knowles Electronics Manikin for Acoustics Research in Electronics category
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INFO: Full form for IDT is Insulation Displacement Termination in Electronics category
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Integrated Device Technology, Inc. is an American corporation headquartered in San Jose, California, that designs, manufactures, and markets low-power, high-performance mixed-signal semiconductor solutions for the advanced communications, computing, and consumer industries. The company markets its products primarily to original equipment manufacturers (OEMs). Founded in 1980, the company began as a provider of complementary metal-oxide semiconductors (CMOS) for the communications business segment and computing business segments. The company is focused on three major areas: communications infrastructure (wireless and wired), high-performance computing, and advanced power management.

INFO: Full form for LPSM is Levenson Phase Shift Mask in Electronics category
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INFO: Full form for HFET is Heterojunction Field Effect Transistor in Electronics category
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INFO: Full form for LVR is Lightbulb Voltage Regulator in Electronics category
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INFO: Full form for RRR is Residual Resistance Ratio in Electronics category
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INFO: Full form for SLAP is Staggered Layered Audio Protection in Electronics category
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INFO: Full form for HSBT is High Speed Bus Transfer in Electronics category
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INFO: Full form for RVP is Radio Voice Phenomena in Electronics category
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INFO: Full form for VBL is Vertical Blanking Level in Electronics category
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In a raster graphics display, the vertical blanking interval (VBI), also known as the vertical interval or VBLANK, is the time between the end of the final visible line of a frame or field and the beginning of the first visible line of the next frame. It is present in analog television, VGA, DVI and other signals.

In raster cathode ray tube displays, the blank level is usually supplied during this period to avoid painting the retrace line — see raster scan for details; signal sources such as television broadcasts do not supply image information during the blanking period. Digital displays usually will not display incoming data stream during the blanking interval even if present.

The VBI was originally needed because of the inductive inertia of the magnetic coils which deflect the electron beam vertically in a CRT; the magnetic field, and hence the position being drawn, cannot change instantly. Additionally, the speed of older circuits was limited. For horizontal deflection, there is also a pause between successive lines, to allow the beam to return from right to left, called the horizontal blanking interval. Modern CRT circuitry does not require such a long blanking interval, and thin panel displays require none, but the standards were established when the delay was needed (and to allow the continued use of older equipment). Blanking of a CRT may not be perfect due to equipment faults or brightness set very high; in this case a white retrace line shows on the screen, often alternating between fairly steep diagonals from right to left and less-steep diagonals back from left to right, starting in the lower right of the display.

In analog television systems the vertical blanking interval can be used for datacasting (to carry digital data), since nothing sent during the VBI is displayed on the screen; various test signals, time codes, closed captioning, teletext, CGMS-A copy-protection indicators, and various data encoded by the XDS protocol (e.g., the content ratings for V-chip use) and other digital data can be sent during this time period. In U.S. analog broadcast television, line 19 was reserved for a Ghost-canceling reference & line 21 was reserved for captioning data. The obsolete Teletext service contemplated the use of line 22 for data transmission.

The pause between sending video data is sometimes used in real time computer graphics to modify the frame buffer, or to provide a time reference for when switching the source buffer for video output can happen without causing a visible tear. This is especially true in video game systems, where the fixed frequency of the blanking period might also be used to derive in-game timing.

On many consoles there is an extended blanking period, as the console opts to paint graphics on fewer lines than the television would natively allow, permitting its output to be surrounded by a border. On some very early machines such as the Atari 2600, the programmer is in full control of video output and therefore may select their own blanking period, allowing arbitrarily few painted lines. On others such as the Nintendo Entertainment System, a predefined blanking period could be extended.

Most consumer VCRs use the known black level of the vertical blanking pulse to set their recording levels. The Macrovision copy protection scheme inserts pulses in the VBI, where the recorder expects a constant level, to disrupt recording to videotapes.

INFO: Full form for LDC is Load Dispatch Centre in Electronics category
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In electronics, a multi-level cell (MLC) is a memory cell capable of storing more than a single bit of information, compared to a single-level cell (SLC) which can store only one bit per memory cell. A memory cell typically consists of a single floating gate MOSFET (metal-oxide-semiconductor field-effect transistor), thus multi-level cells reduce the number of MOSFETs required to store the same amount of data as single-level cells.

Triple-level cells (TLC) and quad-level cells (QLC) are versions of MLC memory, which can store three and four bits per cell, respectively. The name "multi-level cell" is sometimes used specifically to refer to the "two-level cell". Overall, the memories are named as follows:

Typically, as the 'level' count increases, performance (speed and reliability) and consumer cost decrease; however this correlation can vary between manufacturers.

Examples of MLC memories are MLC NAND flash, MLC PCM (phase change memory), etc. For example, in SLC NAND flash technology, each cell can exist in one of the two states, storing one bit of information per cell. Most MLC NAND flash memory has four possible states per cell, so it can store two bits of information per cell. This reduces the amount of margin separating the states and results in the possibility of more errors. Multi-level cells which are designed for low error rates are sometimes called enterprise MLC (eMLC).

New technologies, such as multi-level cells and 3D Flash, and increased production volumes will continue to bring prices down.

INFO: Full form for MLC is Metal Loss Corrector in Electronics category
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Continuous-flow manufacturing, or repetitive-flow manufacturing, is an approach to discrete manufacturing that contrasts with batch production. It is associated with a just-in-time and kanban production approach, and calls for an ongoing examination and improvement efforts which ultimately requires integration of all elements of the production system. The goal is an optimally balanced production line with little waste, the lowest possible cost, on-time and defect-free production.

This strategy is typically applied in discrete manufacturing as an attempt to handle production volumes comprising discrete units of product in a flow which is more naturally found in process manufacturing. The basic fact is that in most cases, discrete units of a solid product cannot be handled in the same way as continuous quantities of liquid, gas or powder.

Discrete manufacturing is more likely to be performed in batches of product units that are routed from process to process in the factory. Each process may add value to the batch during a run-time or work-time. There is usually some time spent waiting for the process during a queue-time or wait-time. The larger the batch, the longer each unit has to wait for the rest of the batch to be completed, before it can go forward to the next process. This queue-time is waste, Muda, and represents time lost that is not value-added in the eyes of the customer. This waste is one of the most important elements targeted for reduction and elimination in lean manufacturing.

Reducing the batch size in discrete manufacturing is therefore a desirable goal: it improves the speed of response to the customer, whilst improving the ratio of value-added to non value-added work. However, it should be balanced against the finite capacity of resources at the value-adding processes. Capacity is consumed by changeover whenever a process is required to perform work on a different part or product model than the preceding one. Time consumed in changeover is also considered waste, and it reduces the amount of resource capacity that is available to perform value-adding work. Reducing batch sizes can also increase handling time, risk and complexity in planning and controlling production.

The paradigm aim is to achieve single-piece flow where a single discrete unit of product flows from process to process. In effect, the batch quantity is one. If there is no change in part or product model, then this objective needs to be balanced against the additional handling time, and the work-centres that perform the process will typically have to be arranged in close proximity to one another in a flow-line. This is often a characteristic of Repetitive-flow manufacturing and most manual assembly work is performed this way in the modern factory.

If there is a change in part or product model, then the process engineer should also consider to balance the changeover time with run-time. If the changeover time is long, as it might be on a machine, batch size reduction is typically preceded with setup reduction techniques such as Single-Minute Exchange of Die.

One methodology for Repetitive-flow manufacturing is Demand Flow Technology which combines the principles of Repetitive-flow and demand-driven manufacturing. The production planning and control is linked to a pull signal that is triggered from a customer order or consumption of finished goods stock. A pull signal can also link a process to the down-stream, and synchronize the flow to the demand of the customer.

INFO: Full form for CFM is Contamination Free Manufacturing in Electronics category
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INFO: Full form for PMC is Process Module Controller in Electronics category
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